Structural behavior of rf magnetron sputtered cupric oxide (CuO) films
Abstract
In this paper a CuO thin film, has been deposited using RF sputtering technique, then the thin film has been characterized by XRD, result obtained showed that strongest peak was 48.6503 degree, and FWHM was 0.145 degree, while lattice constant was 4.65 Aº, and the average grain size was 62.78 nm. While AFM analysis showed that the increasing of another four samples temperature led to increase of roughness average from (3.77 to 15.7) nm, root mean square from (4.66 to 18.8) nm and ten points height from (22.6 to 52.6) at 250,300,350 and 400 C respectively. On the other hand granularity cumulation distribution charts showed average diameter has varied from (57.42, to 135.41) nm with grain numbers per line ( 364, to 135) respectively.
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